TIE2012 Sponsors

Nr. crt. Last Name First Name CAD University Score  1 ALDEA ALIN PADS 9.3 Piteşti 262  2 TURDEAN MIHAI ORCAD 10.5 Cluj Napoca 251  3 ANDRIEŞ LUCIAN Altium 10 Suceava 251  4 AVĂDANII ALEXANDRU Altium 10 Bucureşti 246  5 MAREŞ MIHAI ORCAD 16.3 Piteşti 239  6 MARIN MARIAN VALENTIN PADS 9.3 Piteşti 230  7 BURGHEAUA MIHAI ALEXANDRU Altium 10 Suceava 226  8 TĂNASE MIHAI Altium 10 Bucureşti 222  9 BOŢILĂ ALEXANDRU PADS 9.4.1 Timişoara 220  10 ŢIBULEAC CĂTĂLIN ORCAD 16.2 Bucureşti 219  11 GORDAN CRISTIAN PADS 9.3 Timişoara 219  12 ANTONOVICI DORIN Altium 10 Suceava 211  13 ARDELEAN MIHAELA PADS [...]

Open the TIE2012 Program Brochure April 26, 2012 “Students” Track “Steering Committee” Track “Technical Committee” Track 08:00-10:00 10:00-12:00 Technical meeting IM301 Room 12:00-14:00 Steering committee meeting IM301 Room 13:30- 14:45 Registration of the participants   Main Hall (Faculty of Engineering main entry Str. E. Cioran, nr. 4) 15:00-18:30 International Workshop „UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES” IE102 Amphitheatre International Workshop „UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES” IE102 Amphitheatre Technical session 1 IM310 Room 18:30-19:45 Student Technical Session Presentation of TIE 2011 subjects,      IE102 Amphitheatre Set-up and checking of contest computers and CAD environments,  IE102 Amphitheatre 20:00-20:45 Dinner [...]

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging. Universitatea „1 Decembrie 1918” Alba Iulia Registration deadline: 23 martie 2012 Local stage: 26 martie 2012 http://www.uab.ro/infostud/index.php Contact: eceuca@uab.ro   Universitatea Transilvania din Braşov Registration deadline: 29 februarie 2012 Local [...]

Workshop „UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES” 26 April 2012 13.30–14.45 Registration 14.45-15.00 Welcome Prof. Ioan P Mihu, “Lucian Blaga” University of Sibiu,  Prof. Paul Svasta, Politehnica University of Bucharest   15.00-16.30 First Session: Soldering Processes in Electronic Assembling Chair: Prof. Zsolt Illyefalvi-Vitéz     15.00-15.30 Leadless Components Rework Processes – A bottle Neck in Electronic Assembling Franz Leitenstern, Head of Sales, Martin GmbH – a Finetech company   15.30-16.00 Enhancement of the Process Capability of Solder Paste Printing   Heinz Wohlrabe, PhD, Dresden University of Technology, Germany   16.00-16.30 Analysis of the temperature, the pressure and the vapour [...]

download the TIE2012 Regulations (.doc file)   INTERCONNECTION TECHNIQUES IN ELECTRONICS ‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST ‑ PURPOSE AND OBJECTIVES This student technical event has the main purpose of evaluating the level of knowledge gained by students in the field of technological computer aided design (CAE-CAD-CAM) of electronic modules, with focus to both THT (through hole technology) and SMT (surface mount technology) technologies. The contest is based on the knowledge obtained at the courses in electronics regarding the design and manufacturing of analogue, digital and mixed electronic modules, as well as on the advanced knowledge of designing PCB interconnection structures [...]

view the TIE2012 Regulations The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging. Organizers for the XXIth Edition: “Lucian Blaga” University of Sibiu, Romania Politehnica University of Bucharest Electronics, Telecommunications and Information Technology Faculty Center of Technological Electronics and [...]

Steering Committee Chairman: Prof. Paul Svasta, Ph.D., “Politehnica” University of Bucharest, Romania Co-Chairman: Prof. Dan Pitică, Ph.D., Technical University of Cluj-Napoca, Romania Members: Prof. Dorel Aiordăchioaie, Ph.D., University of “Dunărea de Jos” Galaţi, Romania Alexandru Borcea, MBA, Romanian Association for Electronic and Software Industry Assoc. Prof. Attila Buchman, Ph.D., University of Baia Mare, Romania Prof. Vlad Cehan, , Ph.D., “Gh. Asachi” Technical University, Iaşi, Romania Prof. Laurenţiu Frângu, Ph.D., University of “Dunărea de Jos” Galaţi, Romania Rosemari Fuica, Ph.D. Association for Promoting Electronic Technology, Romania Prof. Aurel Gontean, Ph.D., “Politehnica” University of Timişoara, Romania Prof. Ioan Liţă, Ph.D., University of [...]