Event Committees

TIEplus  Steering Committee

Chairman:
Cătălin NEGREA, Continental Automotive, Timişoara

Co-Chairman:
Marcel Manofu, Continental Automotive, Timişoara, Romania

Members:
Prof. Paul Svasta, Ph.D., “Politehnica” University of Bucharest, Romania
Prof. Dan Pitică, Ph.D., Technical University of Cluj-Napoca, Romania
Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest, Romania
Cosmin Moisă, Continental Automotive, Timişoara, Romania

 

TIEplus Organizing Committee

 

Coordinator: Marcel Manofu, Continental Automotive, Timişoara, Romania
Andreea-Luminita Tasnadi, Continental Automotive, Timişoara, Romania
Bogdan Mihăilescu, Ph.D., Association for Promoting Electronic Technology, Romania
Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest, Romania
Mihai Dărăban, Ph.D., Technical University of Cluj-Napoca, Romania
Radu Voina,
 Principal Engineer,  Keytek, Alba Iulia, Romania

 

TIEplus Technical Committee Members

 

Cătălin Negrea, Ph.D., Continental Automotive, Timişoara, Romania
Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest, Romania
Markus Laudien, Lead Application Engineer, ANSYS, Germany
Danilo DiFebo, Ph.D., Solution Consultant Specialist, Simulia, Italy
Marcel Manofu, SI/PI Principal Engineer, Continental Automotive, Timişoara, Romania
Mihai Burgheaua, Layout Engineer, Continental-OSRAM, Iasi, Romania
Andreea-Luminita Tasnadi, Continental Automotive, Timişoara, Romania
Radu Voina, CST Application Engineer, Caelynx Europe, Romania
Răzvan Neag, SI/PI Engineer, Continental Engineering Services, Timişoara, Romania
Alexandru Amariei, SI/PI Engineer, Continental Engineering Services, Timişoara, Romania
Roxana Vlăduță, SI Engineer, eSilicon, București, Romania