updated 26th of October 2021
Electronic Week 2021 – Brochure and Advanced Programme [Download PDF]
2021
TIE 2021 Schedule and Access Links [Download PDF]
updated 25rd of October 2021
TIE and TIEplus 2021 will be held on the Microsoft Teams platform provided by Technical University of Cluj-Napoca (UTCN).
Every TIE and TIEplus participant or committee member has been sent information related to the access on Microsoft Teams, but we may kindly ask you to register into the platform using your e-mail address.
This action ensures proper access to your dedicated committee communication channel.
Please fill in this Form: https://forms.office.com/r/qjgxBhrvhB
In case that the email address is not syncing with the Teams platform, please select the „NO” option from the first question in the Form, and we will generate an account for you, dedicated to TIE & TIE Plus, that will not be accessible after 27 October 2021, the last day of TIE. We will communicate the credentials and the activation link to the email address specified by the secretariat.
Access the Microsoft Teams group for TIE and TIEplus 2021 above
Miele Tehnica Brașov is a subsidiary of Miele & Cie. KG, Germany. It was established in 2009 as a second electronics factory in the group, after the plant in Gütersloh.
The Miele plant in Braşov currently has 300 employees and produces electronic components for a wide range of Miele appliances, such as washing machines, tumble dryers, vacuum cleaners, ovens and others. The products Miele offers to its customers set the standards for durability, performance, ease of use, energy efficiency, design and service products.
In august 2015, in Brașov, a software development division was created. Within this new division the software for a wide variety of Miele appliances is developed.
The facility in Brașov is equipped with state-of-the-art technology and all quality requirements are respected according to the Miele Group’s standards. This fact is acknowledged by all the certifications currently in place: ISO 9001, ISO 14001, ISO 50001, OHSAS 18001 and SA 8000.
Address: No.1 Carl Miele Street, 507065 Feldioara, Braşov, Romania
Phone: 0040-372-217800, Fax: 0040-372-217810
Be a SPONSOR!
Sponsorship packages Electronic Week 2021 (TIE and SIITME events)
Partners
- Politehnica University of Bucharest || CETTI
- UTCN || UTCN ETTI
- ARIES
- APTE
- IPC
- L&G ADVICE SERV SRL | educare, formare și certificare profesională conform IPC
- IEEE – Electronics Packaging Society (EPS)
- MIELE Romania || Sponsor description page
- Continental || Sponsor description page
- IMAPS Romania Chapter
- IEEE EPS Hu&Ro Joint Chapter
- EPETRUN
Technical Sponsors
- Continental
- Plexus Oradea
- PCB Libraries
- Microchip Romania
- Dräxlmaier
- RSX Engineering
- Yazaki
- TCM Romania
- Celestica
- DIGILENT
- Caelynx
Platinum Sponsors
Gold Sponsors
Sponsors
The Electronic Industry Week Central and South Eastern Europe
TIE (TIEplus) & SIITME 2021
(full online LIVE events)
(time is EEST | GMT +3)
| Monday, October 25 | |
| 09:00 – 09:30 | Opening ceremony for the Electronic Industry Week |
| 09:30 – 10:00 | TIEPlus opening, subject introduction |
| 10:00 – 12:30 | TIEPlus CONTEST |
| 12:30 – 14:00 | Lunch Break |
| 14:00 – 16:00 | TIEplus Virtual Prototype Workshop |
| 16:30 – 18:00 | TIEplus 2021 subject demystification |
| 18:00 – 19:00 | TIE– technical session |
| Tuesday, October 26 | |
| 07:45 – 08:15 | TIE contest preliminary activities |
| 08:15 – 12:45 | TIE CONTEST |
| 12:45 – 14:00 | Lunch Break |
| 14:00 – 20:00 | Assessment of the projects; litigations |
| 20:00 – 21:30 | TIE 2021 Committee Meeting |
| Wednesday, October 27 | |
| 09:00 – 12:00 | Strategic Partnership for Education Workshop |
| 12:00 – 12:45 | TIE 2021 subject demystification |
| 12:45 – 13:30 | TIE and TIEplus Awarding ceremony |
| 13:30 – 14:30 | Lunch Break |
| 14:30 – 18:30 | Professional Development Course |
| 18:30 – 20:30 | IEEE – Hu & RO EPS&NTC Joint Chapter Meeting |
| Thursday, October 28 | |
| 08:45 – 09:00 | Opening ceremony |
| 09:15 – 11:10 | Plenary Oral Session 1 |
| 11:20 – 13:30 | Plenary Oral Session 2 |
| 13:30 – 14:30 | Lunch Break |
| 14:30 – 14:50 | Industrial Session 1 |
| 15:00 – 16:30 | Poster Session 1 |
| 16:40 – 18:55 | Plenary Oral Session 3 |
| 19:00 – 20:00 | Networking IEEE, IMAPS Student Branch Chapter Kick-off Meeting |
| Friday, October 29 | |
| 08:30 – 10:00 | Poster Session 2 |
| 10:10 – 10:50 | Industrial session 2 |
| 10:50 – 12.20 | Plenary Oral Session 4 |
| 12:20 – 13:00 | Industrial Workshop |
| 13:00 – 14:00 | Lunch Break |
| 14:00 – 14:40 | Special Session |
| 14:40 – 16:10 | Poster Session 3 |
| 16:20 – 17:50 | Plenary Oral Session 5 |
| 17:50 – 19:30 | Steering Committee Meeting |
| 19:30 – 20:30 | Awarding ceremony & Welcome to SIITME 2022 & ESTC2022 |
EEST | GMT +3h
Electronic Week 2021 – TIE (TIEplus) & SIITME – Final Program [PDF]
Steering Committee
General Chair:
Paul SVASTA, Politehnica University of Bucharest, APTE
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca
General Industrial Co-Chair:
Cosmin MOISĂ, Continental Automotive, Timişoara
TIE 2021 Chair:
Liviu VIMAN, Technical University of Cluj-Napoca
TIE 2021 Co-Chair:
Gabriel CHINDRIŞ, Technical University of Cluj-Napoca
Steering Committee Members:
Dorel AIORDĂCHIOAIE, Dunărea de Jos University of Galaţi
Ilie BERILIU, Lucian Blaga University of Sibiu
Alexandru BORCEA, Romanian Association for Electronic and Software Industry
Radu BOZOMITU, Gh. Asachi Technical University of Iaşi
Vlad CEHAN, Gh. Asachi Technical University of Iaşi
Gabriel CHINDRIŞ, Technical University of Cluj-Napoca
Eugen COCA, Ştefan cel Mare University of Suceava
Elena DOICARU, University of Craiova
Aurelia FLOREA, Human Resources Manager, Miele Brasov
Aurel GONTEAN, Politehnica University of Timişoara
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Mihaela HNATIUC, Maritime University of Constanţa
Ciprian IONESCU, University Politehnica of Bucharest
Ioan LIŢĂ, University of Piteşti
Bogdan MIHĂILESCU, University Politehnica of Bucharest, APTE
Viorel NICOLAU, Dunărea de Jos University of Galaţi
Cristina OPREA, Tensor srl
Gheorghe PANĂ, Transilvania University of Braşov
Daniela TĂRNICERIU, Gh. Asachi Technical University of Iaşi
Daniel TRIP, University of Oradea
Adrian TULBURE, 1 Decembrie 1918 University of Alba Iulia
Gabriel VLĂDUŢ, Romanian Association for Technological Transfer and Innovation
International Advisory Body:
Karlheinz BOCK, TU Dresden, Electronics Packaging Lab IAVT, Dresden, Germany
Detlef BONFERT, Fraunhofer EMFT, Munich Germany
Joseph FJELSTAD, CEO of Verdant Electronics, USA
Zsolt ILLYEFALVI-VITEZ, University of Technology and Economics, Budapest, Hungary
Pavel MACH, Czech Technical University in Prague, Czech Republic
Alain MICHEL, ANSYS France
Jim MORRIS, Portland State University, Oregon USA
Andy SHAUGHNESSY, Managing Editor of The PCB Design Magazine and PCBDesign007, USA
Nihal SINNADURAI, IMAPS ELC Past President, U.K.
Heinz WOHLRABE, TU Dresden, Germany
Klaus-Jürgen WOLTER, TU Dresden, Germany
Technical Committee – Academic Trainers
Chairman:
Norocel CODREANU, Politehnica University of Bucharest
Co-Chairman:
Liviu VIMAN, Technical University of Cluj-Napoca
Members:
Mihaela ANDREI, Dunărea de Jos University of Galaţi
Constantin BARABAŞA, Gh. Asachi Technical University of Iaşi
Marius CARP, Transilvania University of Braşov
Emilian CEUCA, 1 Decembrie 1918 University of Alba Iulia
Cătălin CONSTANTINESCU, University of Craiova
Silviu EPURE, Dunărea de Jos University of Galaţi
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Septimiu LICĂ, Politehnica University of Timişoara
Claudiu LUNG, University of Baia Mare
Mihai DĂRĂBAN, Technical University of Cluj-Napoca
Adrian TĂUT, Technical University of Cluj-Napoca
Raul FIZEȘAN, Technical University of Cluj-Napoca
Alin Gheorghiță MAZĂRE, University of Piteşti
Maximilian NICOLAE, University Politehnica of Bucharest
Mihaela PANTAZICĂ, University Politehnica of Bucharest
Mirel PĂUN, Maritime University of Constanţa
Adrian PETRARIU, Ştefan cel Mare University of Suceava
Adrian ŞCHIOP, University of Oradea
Emanoil TOMA, Lucian Blaga University of Sibiu
Industrial Committee
Chairman:
Mihai FEDOREAC, Continental Automotive, Timişoara
Industrial Co- Chair:
Bogdan POPESCU, MICROCHIP Technology, Bucureşti
Members:
Alexandru AMARIEI, Continental Engineering Services, Timişoara
Gheorghe AMARIEI, Continental Engineering Services, Timişoara
Adrian BOSTAN, MICROCHIP Technology, Bucureşti
Aurelian BOTĂU, Continental Automotive, Timişoara
Valentin Cătălin BURCIU, Draexlmaier Romania
Mihai BURGHEAUA, Continental Automotive, Iaşi
Iulian BUŞU, LUMPED Elements, Bucureşti
Mihai CENUȘĂ, Continental Automotive, Iaşi
Alin GHENESCU, Continental Automotive Systems, Sibiu
Nicolae GROSS, Continental Automotive Systems, Sibiu
Florin HEREDEU, Plexus, Oradea
Florin Bogdan MARANCIUC, Continental Automotive Systems, Sibiu
Ionuţ Alexandru MARIN, Continental Automotive Systems, Sibiu
Andrei NICORAŞ, Plexus, Oradea
Cosmin OBREJA, Vitesco Technologies Engineering Romania
Andras PARANICI, Vitesco Technologies Engineering Romania
Bogdan PICĂ, NTT DATA Romania, Cluj
Mariana POPÂRLAN, Vitesco Technologies Engineering, Sibiu
Alexandru Gheorghiță RĂCHERU, Continental Automotive, Sibiu
Csaba TĂRCEAN, Continental Engineering Services, Timişoara
Bogdan Iulian TELEGARIU, Vitesco Technologies Engineering, Sibiu
Corneliu TOMA, Digitech SRL, Bucureşti
Mihai VIDRAŞCU, Autonomous Flight Technology, Bucureşti
Radu VOINA, KEYTEK Innovation, Alba Iulia
Virtual Conference Management Committee
Chair: Bogdan Orza, Technical University of Cluj-Napoca, Romania
Ionel BACIU, Technical University of Cluj-Napoca, Romania
Vlad BANDE, Technical University of Cluj-Napoca, Romania
Aurelia CIUPE, Technical University of Cluj-Napoca, Romania
Andreea Gabriela LUPASCU, Technical University of Cluj-Napoca, Romania
Miruna CONT, Technical University of Cluj-Napoca, Romania
Rajmond JÁNÓ, Technical University of Cluj-Napoca, Romania
Marius TĂUT, Technical University of Cluj-Napoca, Romania
IEEE EPS Student Chapters Support Committee
Chair: Alin GRAMA, IEEE-EPS, Technical University of Cluj-Napoca, SBC Chair
Co-Chair: Mădălin MOISE, IEEE-EPS, University Politehnica of Bucharest
Members:
Andreea DUMITRAȘCU, University Politehnica of Bucharest
Valentina DUMITRAȘCU, University Politehnica of Bucharest
Alina MARCU, University Politehnica of Bucharest
Daniela PAVEL, University Politehnica of Bucharest
Elena STETCO, Technical University of Cluj-Napoca
Technical secretariat
Chair: Delia LEPĂDATU, University Politehnica of Bucharest
Co-Chair: Ana Maria CHIRILĂ, Continental Automotive, Timișoara
Members:
Cristina LEPĂDATU, Association for Promoting Electronic Technology Bucharest
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology Bucharest
Maria PĂTULEANU, University Politehnica of Bucharest
Florentina STĂLINESCU, Association for Promoting Electronic Technology Bucharest
Adelina ILIES, Technical University of Cluj-Napoca, Romania
TIEPlus Steering Committee
Chairman:
Cătălin NEGREA, Continental Automotive, Timişoara
Co-Chairman:
Marcel MANOFU, Continental Automotive, Timişoara, Romania
Members:
Norocel CODREANU, University Politehnica of Bucharest
Cosmin MOISĂ, Continental Automotive, Timişoara
Dan PITICĂ, Technical University of Cluj-Napoca
Paul SVASTA, University Politehnica of Bucharest
TIEPlus Organizing Committee
Coordinator: Marcel MANOFU, Continental Automotive, Timişoara
Norocel CODREANU, University Politehnica of Bucharest
Mihai DĂRĂBAN, Technical University of Cluj-Napoca, Romania
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology
Andreea-Luminiţa TASNADI, Continental Automotive, Timişoara
Radu VOINA, Principal Engineer, Keytek, Alba Iulia, Romania
TIEPlus Technical Committee Members
Mihai BURGHEAUA, Layout Engineer, Continental-OSRAM, Iaşi
Norocel CODREANU, University Politehnica of Bucharest
Danilo Di FEBO, Business Development, CST, Italy
Markus LAUDIEN, Lead Application Engineer, ANSYS, Germany
Marcel MANOFU, SI/PI Principal Eng., Continental Automotive, Timişoara
Răzvan NEAG, SI/PI Eng., Continental Engineering Services, Timişoara
Cătălin NEGREA, Continental Automotive, Timişoara
Camelia STOICA, EBU Technical Services, INAS, Craiova
Roxana VLĂDUȚĂ, SI Engineer, eSilicon, București
Radu VOINA, Digilent, Cluj-Napoca
TIEPlus 2021 Registered Participants: TBD
TIEPlus University Licensing Sponsors:
