WORKSHOP TIE 2013 – Program and presentations

Downloadable presentations:
Oliver Krammer – Stencil Design Guidelines for Electronics Assembly Technologies
Detlef Bonfert, Karlheinz Bock – Advanced Topics In Electronic Assembling Technology
Dominik Beier – Smart electronics in home appliances – MIELE

 

WORKSHOP TIE 2013

„Advanced Topics in Electronic Assembling Technology”

April 25, 2013

 

13.00-14.15

Registration

14.15-14.30

Welcome

Prof. Carmen Gerigan, “Transilvania” University of Braşov,
Prof. Paul Svasta, Politehnica University of Bucharest

 

14.30-16.30

First Session: PCB Design

Session chair: Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology

14.30-15.50

PCB Design Behind EMC Thinking

Lorand Foelkel, M. Eng. Würth Elektronik

15.50-16.30

Design and Measurement of Integrated Passive Devices on Flexible Substrates

Detlef Bonfert, PhD, EMFT Munich, Germany

 

16.30-17.00

Networking Break

17.00-19.00

Second Session: Assembling Technology

Session chair Prof. Dan Pitică, Technical University of Cluj Napoca

17.00-17.30

Selection/Supplying of Electronic Components an Important Step for Electronic Modules Manufacturing

Wojtek Kuczyński, Transfer Multisort Electronik, Poland

17.30-18.30

Stencil Manufacturing Technologies and Stencil Design Guidelines

Oliver Krammer, Ph.D., Electronic Technology Department, Budapest University of Technology

18.30-19.00

Smart electronic devices in Household Appliance

Dominik Beier – Team Leader, Development Department – Miele Electronics