2012

CAD design of electronic circuits (SCM, SCH);
Creation of virtual components (parts);
SCM post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation);
CAD design of on-board interconnection structures (PCB);
Creation of PCB footprints;
Professional inter-tool communication techniques between SCM and PCB environments;
PCB post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation and manufacturing);
Standardization elements for PCB design;
Elements of analogue, digital and mixed design;
Elements of signal integrity and electromagnetic compatibility at the PCB level.

We thanks to our sponsors, companies and individuals, and we are grateful for their constant and enthusiastic technical, financial and moral support at all editions of the TIE contest for more than 20 years!

Companies

Microchip
Blue Air


Continental Automotive System SRL
Maquardt Schaltsystems SCS
Mentor Graphics
Kromberg & Schubert Romania Me
Wenglor Electronic SRL
Romstrade
Elsix
ELREF
Kuhnke Production Romania SRL
LG Advice Serv

Roel

EOC
Samway
EBS
Radio Consult

Antrice

SC Rond Electric SRL
Takata Sibiu
Cavallioti

 

Individuals

Radu Cosăceanu, graduate Politehnica University of Bucharest
Laszlo Dobos, graduate Politehnica University of Bucharest, former member of the teaching staff of Politehnica University, Applied Electronic Department
Vergil Goian, graduate Politehnica University of Bucharest
Mihai Jurbă, graduate University of Bucharest
Corina Sandulescu, graduate Politehnica University of Bucharest
Mihai Savu, graduate Politehnica University of Bucharest, former winner of TIE contest

View Workshop Presentations

UPDATE: view the TIE2012 General Program

April 26, 2012

“Students” Track “Steering Committee” Track “Technical Committee” Track
08:00-10:00
10:00-12:00

Technical meeting

x Room

12:00-14:00

Steering committee meeting

x Room

13:30- 14:45

Registration of the participants

x Room

15:00-18:30

International Workshop UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES”

x Room

International Workshop UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES”

x Room

Technical session 1

x Room

18:30-19:45

Student Technical Session

·        Presentation of TIE 2011 subjects, Room …

·        Set-up and checking of contest computers and CAD environments, Room …

20:00-20:45

Dinner

21:00-22:30

Steering committee meeting,
x Room

Technical session 2,
x Room

April 27, 2012

07:00-07:30

Breakfast

07:30-08:00

Technical preparation

Technical preparation

Technical preparation

08:00-12:00

CONTEST

Technical session 3

12:00-13:00

Lunch

13:00-18:00

Assessment of the projects

Assessment of the projects

Assessment of the projects

18:00-19:00

Steering committee meeting

19.00-20.00

TIE 2012

Awarding ceremony

TIE 2012

Awarding ceremony

TIE 2012

Awarding ceremony

20:00-22:00

Gala dinner TIE 2012

April 28, 2012

07:30-08:30

Breakfast

09:00-12:00

Ending session

Final remarks

Classification
TIE 2012
~ IAC certification ~

The first 14 competitors have received from the IAC (Industrial Advisor Committee) the „PCB Designer” degree, as a recognition of their high level of knowledge in the field of CAD for development of electronic modules and assemblies.

Nr. crt.

Last Name

First Name

CAD

University

Score

 1 ALDEA ALIN

PADS 9.3

Piteşti

262

 2 TURDEAN MIHAI

ORCAD 10.5

Cluj Napoca

251

 3 ANDRIEŞ LUCIAN

Altium 10

Suceava

251

 4 AVĂDANII ALEXANDRU

Altium 10

Bucureşti

246

 5 MAREŞ MIHAI

ORCAD 16.3

Piteşti

239

 6 MARIN MARIAN VALENTIN

PADS 9.3

Piteşti

230

 7 BURGHEAUA MIHAI ALEXANDRU

Altium 10

Suceava

226

 8 TĂNASE MIHAI

Altium 10

Bucureşti

222

 9 BOŢILĂ ALEXANDRU

PADS 9.4.1

Timişoara

220

 10 ŢIBULEAC CĂTĂLIN

ORCAD 16.2

Bucureşti

219

 11 GORDAN CRISTIAN

PADS 9.3

Timişoara

219

 12 ANTONOVICI DORIN

Altium 10

Suceava

211

 13 ARDELEAN MIHAELA

PADS 9.3

Timişoara

205

 14 ŞTEFAN ANDREI

Altium 10

Bucureşti

205

Up to Date Issues in
Electronic Assembling Technologies
26th April 2012, Sibiu, Romania

Analysis of the temperature, the pressure and the vapour density in a VPS chamber to optimize the conditions for soldering
Géczy Attila
Budapest University of Technology and Economics
Dept. of Electronics Technology

Application of Safety Bonding Methods to
Gold Wire Bonding to Improve Yield and Reliability
(and slides)
Zsolt Illyefalvi-Vitéz
Budapest University of Technology and Economics
Dept. of Electronics Technology

Organic Electronics, Materials, Devices and Technologies
Assoc. Prof. Ciprian Ionescu, Ph.D.
Assoc. Prof. Norocel Codreanu, Ph.D.
Politehnica University of Bucharest
Faculty of Electronics, Telecommunications and Information Technology

Cost Optimizing vs. Reliability in EMS Assembling Activities
Ioan Plotog, Ph.D.
Politehnica University of Bucharest
Center for Technological Electronics and Interconnection Techniques

Lead Less Rework Components Processes A Bottle Neck in Electronic Assembling
Franz Leitenstern
Head of Sales, Martin GmbH

Enhancement of Process Capability of Solder Paste Printing
H. Wohlrabe
TU Dresden Germany