The Electronic Week of Electronics Packaging Community The 30^th Edition, ONLINE
25^th-27^th OCTOBER 2021
2 events: TIE (TIEplus) & IEEE Symposium SIITME

ONLINE, Romania
25th-27th October 2021

Electronic Week 2021 – Preliminary program
June 3, 2021 · 0 Comments
PreliminaryProgramme for the ELECTRONIC WEEK 2021 – TIE (TIEplus) and SIITME 2021 events | updated 2nd of June 2021

TIE Contest Regulation
June 3, 2021 · 0 Comments
‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑
What Design Tool to use for TIE Contest
June 3, 2021 · 0 Comments
Design Tools Recommendation for Participation to TIE Professional Student Design Contest

TIE Contest – Extended technical and scientific references
June 3, 2021 · 0 Comments
Standards | Books | References
TIE Concept
June 3, 2021 · 0 Comments
The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.

The Electronic Week of Electronics Packaging Community The 30th Edition, ONLINE 25th-27th OCTOBER 2021 2 events: TIE (TIEplus) & IEEE Symposium SIITME