The Electronic Week of Electronics Packaging Community The 31st Edition,
IN PERSON in Bucharest, ROMANIA
24th-29th OCTOBER 2022 2 events: TIE & IEEE Symposium SIITME
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Previous TIE Event -
Previous TIE Event -
Previous TIE Event -->
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Previous TIE Event -
Central Library of UPB (venue for TIE2022)
TIE 2022
Bucharest, Romania
24th-29th October 2022
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Participation at TIE 2022 | TIEplus | TIEm
August 19, 2022News about TIE 2022 | TIEplus | TIEm
Updated 19 August 2022Continental Automotive – PLATINUM SPONSOR OF TIE 2021
August 19, 2022Continental Automotive – The Future in Motion | TIE 2021 Platinum Sponsor
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BOSCH Romania – PLATINUM SPONSOR OF TIE 2021
August 19, 2022BOSCH Romania – Invented for life | TIE 2021 Platinum Sponsor
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TIE 2021 PARTNERS – TECHNICAL SPONSORS – SPONSORS
August 19, 2022Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors
EVENT COMMITTEES TIE 2022
August 19, 2022Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE Contest – Extended technical and scientific references
August 19, 2022Standards | Books | References
What Design Tool to use for TIE Contest
August 19, 2022Design Tools Recommendation for Participation to TIE Professional Student Design Contest
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TIE Contest Regulation
August 19, 2022‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑
TIE Concept
August 19, 2022The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.