The Electronic Week of Electronics Packaging Community The 29^th Edition, ONLINE, 19^th-20^th OCTOBER 2020
2 events: TIE (TIEplus) & IEEE Symposium SIITME

WebEx Events links to the Evaluation Sessions of TIE 2020 for Tuesday 20th October 2020

General Programme for the ELECTRONIC WEEK 2020 – TIE and TIEplus and SIITME 2020 events | updated 17th of October 2020

In-depth details about the 1st ONLINE Electronic Industry Week 2020 | updated 17th of October 2020

VITESCO Technologies | TIE 2020 Platinum Sponsor

Due to recent development of the COVID-19 virus in Bucharest, Romania, the Steering Committee has decided to postpone the TIE 2020 event for the period 6th-9th May 2020.

TIE 2020 – Promotional Poster – all participant Universities

Be a SPONSOR! | Pachete de sponsorizare TIE 2020 | Sponsorship packages TIE 2020 | Partners and Technical Sponsors | Platinum and Gold Sponsors

Design Tools Recommandation for Participation to TIE Professional Student Design Contest

Politehnica University of Bucharest (UPB) – TIEplus & TIE organizer

‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑

Continental Automotive – The Future in Motion | TIE 2020 Platinum Sponsor

Miele Tehnica | TIE 2020 Platinum Sponsor

BOSCH Romania – Invented for life | TIE 2020 Platinum Sponsor

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992.

Steering Committee Members
Technical Committee
Programm Committee
International Advisory Body
Industrial Advisor Committee
Virtual Conference Management Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

Standards | Books | References