Technologies of Interconnections in Electronics
The 35^th Edition, Cluj-Napoca, ROMANIA
22^nd-25^th APRIL 2026
TIE-E | TIE-E+ | TIE-M | TIE-M+ | TIE-T+ | TIE-^µ | TIE-ⁿ

TIE micro 2026 Committee

TIE-T Plus 2026 Committee

TIE-E Plus 2026 Committee

TIE-M 2026 COMMITTEES

Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement.

TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.

TIE-μ is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets.

TIE-E Plus Contest Regulation 2026

TIE-M Plus 2026 COMMITTEES

Recommended Standards | Books | References

PROFESSIONAL STUDENT CONTEST TIE REGULATION

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.

Design Tools Recommendation for Participation to TIE Professional Student Design Contest

Preliminary TIE 2026 Program and Joint Events

TIE 2026 Promotional Poster with overview of Topics

Be a SPONSOR!  Contact us here! Sponsorship packages TIE 2026 (all events)        

Video highlights and interviews of TIE 2025