The Electronic Week of Electronics Packaging Community The 30th Edition, ONLINE
25th-27th OCTOBER 2021
2 events: TIE (TIEplus) & IEEE Symposium SIITME

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Technical University of Cluj-Napoca Faculty of Electronics, Telecommunications and Information Technology

TIE 2021

ONLINE, Romania
25th-27th October 2021

  • EVENT COMMITTEES TIE 2021

     September 20, 2021 · 0 Comments

    Steering Committee Members
    Technical Committee
    Programme Committee
    International Advisory Body
    Industrial Advisor Committee
    Virtual Conference Management Committee
    IEEE EPS Student Chapters Support Committee
    Local Organizing Committee

    Electronic Week 2021 – Preliminary program

     June 3, 2021 · 0 Comments

    PreliminaryProgramme for the ELECTRONIC WEEK 2021 – TIE (TIEplus) and SIITME 2021 events | updated 2nd of June 2021

  • TIE Contest Regulation

     June 3, 2021 · 0 Comments

    ‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑

    What Design Tool to use for TIE Contest

     June 3, 2021 · 0 Comments

    Design Tools Recommendation for Participation to TIE Professional Student Design Contest

  • TIE Contest – Extended technical and scientific references

     June 3, 2021 · 0 Comments

    Standards | Books | References

    TIE Concept

     June 3, 2021 · 0 Comments

    The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.