The Spring Convention of Electronic Packaging Community The 33rd Edition,
IN PERSON in Sibiu, ROMANIA
24th-27th APRIL 2024 6 topics: TIE-E & TIEplus & TIE-M & TIE-M plus & TIE-T plus & TIE-µ premiere
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TIE 2024 PARTNERS – TECHNICAL SPONSORS – SPONSORS
February 23, 2024Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors
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TIE_M Plus 2024 PROMOTIONAL POSTER
February 23, 2024TIE_Mplus 2024 Second Edition & Registration LINK | Supported by FIMM
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EVENT COMMITTEES TIE-M & TIE-M Plus 2024
February 23, 2024TIE-M & TIE-M Plus 2024 Steering Committee Members
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TIE Contest – Extended technical and scientific references
January 18, 2024Recommended Standards | Books | References
What Design Tool to use for TIE Contest
January 18, 2024Design Tools Recommendation for Participation to TIE Professional Student Design Contest
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TIE Concept
January 18, 2024The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.