The Electronic Week of Electronics Packaging Community The 30^th Edition, ONLINE
25^th-27^th OCTOBER 2021
2 events: TIE (TIEplus) & IEEE Symposium SIITME

In-depth details about the 2nd ONLINE Electronic Industry Week 2021 | updated 23rd of October 2021

Acces links to Day 1, 2 & 3 of TIE and TIEplus 2021 events

Acces to online events TIE and TIEplus 2021 || Microsoft Teams Link

Miele Tehnica | TIE 2021 Platinum Sponsor

BOSCH Romania – Invented for life | TIE 2021 Platinum Sponsor

Continental Automotive – The Future in Motion | TIE 2021 Platinum Sponsor

Be a SPONSOR! | Pachete de sponsorizare TIE 2021 | Sponsorship packages TIE 2021 | Partners and Technical Sponsors | Platinum and Gold Sponsors

PreliminaryProgramme for the ELECTRONIC WEEK 2021 – TIE (TIEplus) and SIITME 2021 events | updated 2nd of June 2021

AlfaTest | TIE 2021 GOLD Sponsor

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
Virtual Conference Management Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑

Design Tools Recommendation for Participation to TIE Professional Student Design Contest

Standards | Books | References

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.