Past Editions Subjects

TIE – Eplus Past Editions Subjects

 

This page contains the TIE-Eplus subject for the past editions.

This will allow you to analyze the difficulty of the subjects and prepare for the upcoming TIE-Eplus challenges.

2023: The diagram below describes the simplified architecture of a System-on-Module PCB that is based on an ARM-Cortex SoC

The subject information for the TIE-Eplus 2023 edition is available in the PDF file below.

TIE-Eplus 2023 Subject

2020: Design the electrical connections within the Light-Control Engine and Picture-Projection of an Augmented Reality Headset System

The subject information for the TIE-Eplus 2020 edition is available in the PDF file below.

TIE-Eplus 2020 Subject

Full subject archive:

TIE-Eplus 2020 Subject archive

 

2019: Design of the power distribution network for the Image Sensor Board of a Space Cube Satellite PCB

The subject information for the TIE-Eplus 2019 edition is available in the PDF file below.

TIE-Eplus 2019 Subject

Full subject archive:

TIE-Eplus 2019 Subject archive

2018: Signal Integrity Analysis of a FPGA graphic accelerator card

The subject information for the TIE-Eplus 2018 edition is available in the PDF file below.

TIE-Eplus 2018 Subject

Full subject archive:

TIE-Eplus 2018 Subject archive

 

 

2017: Power Integrity Analysis of a DDR3 interface supply rail

The subject information for the TIE-Eplus 2017 edition is available in the PDF file below.

TIE-Eplus 2017 Subject

Full subject archive:

TIE-Eplus 2017 Subject archive

 

 

2015:Signal Integrity Analysis of a differential RSDS channel

The subject information for the TIE-Eplus 2015 edition is available in the PDF file below.

TIE-Eplus 2015 Subject

Full subject archive (with modeling information):

TIE-Eplus 2015 Subject archive