Preliminary Programme Workshop TIE 2013

UPDATE: Workshop Program TIE2013

Preliminary Programme

WORKSHOP TIE 2013

„ADVANCED TOPICS IN ELECTRONIC ASSEMBLING TECHNOLOGY”

April 25, 2013

 

13.00–14.15

Registration

14.15-14.30

Welcome

Prof. Carmen Gerigan, “Transilvania” University of Braşov,
Prof. Paul Svasta, Politehnica University of Bucharest

 

14.30-16.30

First Session: PCB Design

Session chair: Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology

14.30-15.50

PCB Design Behind EMC Thinking

Lorand Foelkel, M. Eng. Würth Elektronik

15.50-16.30

Design and Measurement of Integrated Passive Devices on Flexible Substrates

Detlef Bonfert, PhD, EMFT Munich, Germany

 

16.30-17.00

Networking Break

17.00-19.00

Second Session: Assembling Technology

Session chair Prof. Dan Pitică, Technical University of Cluj Napoca

17.00-17.30

Selection/Supplying of Electronic Components an Important Step for Electronic Modules Manufacturing

Wojtek Kuczyński Transfer Multisort  Electronik, Poland

17.30-18.30

Stencil Manufacturing Technologies and Stencil Design Guidelines

Oliver Krammer, Ph.D., Electronic Technology Department, Budapest University of Technology

18.30-19.00

Smart electronic devices in Household Appliance

Dominik Beier – Team Leader,  Development Department – Miele Electronics

 Download Preliminary Programme Workshop TIE 2013 [PDF]