The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.
Organizers for the XXIth Edition:
Local organizers: ULB SIBIU
Prof. Ioan P. Mihu Ph.D., “Lucian Blaga” University of Sibiu, Romania
As.ing. Emanoil Toma, “Lucian Blaga” University of Sibiu, Romania
drd. ing. Tudor Dachin, Continental Automotive System SRL, Sibiu
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